GEIA HB 0005 2 PDF

Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.

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Charles Cawthorne then introduced Dr Mark Ashworth of Loughborough University, who discussed the effect of plating methodologies, the first of two presentations describing research carried out at Loughborough into mechanisms and strategies for tin whisker mitigation. And he quoted instances of systems failure in communications satellites originating from tin whiskers. No, the group members do not all have curly hair!

Need more than one copy? It hg intended to continue ageing the test vehicles and review failures after a further six months, and to visually inspect the assemblies again after twelve months, also to build control assemblies to investigate the effect of temperature during coating.

Other viable mitigation practices were hot-dip tinning for structural steel parts, or hot-oil fused tin plating.

Therefore, the use of adequate reflow soldering processes is critical for producing solder joints that are acceptable for their end-product use environment. Whisker growth was reduced by increasing deposit thickness and by deposition at higher current densities. In summary, as the standards had evolved, they had become increasingly definitive with regard to component-to-component spacing design rules. This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems.

A remarkable observation was that in some instances it could be several years before whiskers began to grow, depending on the substrate and stress level.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

The focus is to provide insight and information such that the bh will maintain performance requirements for aerospace, defense, and high-performance ADHP products and systems. This paper presents a summary of efforts from document inception to document release. Since the introduction of the RoHS legislation inthe threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry.


If the document is revised or amended, geiaa will be notified by email. One observation was nb failure predominantly occurred at the edges of plates, where full coating thickness was not maintained around the right angle bend, and this geometry was a characteristic feature of component leads.

He began his presentation on problems associated with whisker growths with a remarkable time-lapse video recorded geiz researchers at Brown University, showing the initiation and growth of a tin whisker at a steady rate of about 1 micron per hour over a period of 40 hours. Please first verify your email before subscribing to alerts.

We have no amendments or corrections for this standard.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Proceed to Checkout Continue Shopping. He distributed copies to delegates, and it is available on-line for free download by clicking here. The factors influencing whisker growth were electroplating bath chemistry, whether pure tin or a tin alloy, bright or matte, heia parameters such as current density, temperature and agitation, and substrate, taking copper, brass and alloy 42 as examples.

You may delete a document from your Alert Profile at any time. Consequently, manufacturers of high-reliability electronics with RoHS exemption were left with no alternative but to manage tin-lead obsolescence by avoidance or mitigation.

With a heavy dependence on COTS to maintain a competitive edge, the industry is heavily influenced by the commercial supply chain and its increasing use of Pb-free materials. A Circuitnet Media Publication. Summarizing at a high level, these challenges represent risks associated with 1 durability of the interconnection and 2 deleterious effects of tin whiskers.


Upon reviewing these plans, several research consortiums and organizations embraced the plan and, to date, have addressed many of the technical needs although the significant effort of obtaining sufficient data to develop Pbfree reliability models still remains unanswered [15]. Although higher currents would cause instant burn-out, in high-vacuum conditions a short circuit could result in a plasma discharge.

Dr Ashworth stressed that these observations 0050 to the particular proprietary electroplating chemistry used in the study, and that other commercial formulations might demonstrate different relationships between current density, deposit microstructure and whisker growth.

But how do we set about mitigating against such failure where the use of pure tin finished components is unavoidable?

Living With PB-Free in High Performance Engineering Design

Subscription pricing is determined by: Finishes to be avoided were silver, plated tin-copper, any tin plating over brass without a copper or nickel barrier, 000 bright tin. Furthermore, the guide highlights Pb-free concerns, as they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries.

While the Pb-free movement may appear ominous and challenging, there are tools and resources available to the designer. A series of collaborative projects had been carried out at the National Physical Laboratory to bh conformal coating as a tin 00005 mitigation strategy for printed circuit assemblies. Dr Dunn had collected data on whiskering effects over a period of 32 years, using the C-Ring test to introduce tensile and compressive stress, with different metal substrates, barrier layers and tin plating thicknesses, and the results were shortly to be published.